HL 8548-G matter for antenna transition

IoT Modules Legacy HL Series
1

Dear HL 8548-G users,

We are looking for the type of matter used for HL8548-G (the component version without cover where everything is embedded into a resin of ??) we think about silicium covered by aluminium but we have to be sure cause we are working on antennas transition in a complex context and permittivity (dielectric constant) + losses (tan delta) are very important for us.

Thanks in advance for your help

2

Hi,
what exactly you want?? materials used to prepare HL8 module or material used to prepare the interface between HL8 module and antenna?

hope below link will help you :slight_smile:
http://source.sierrawireless.com/resources/airprime/hardware_specs_user_guides/airprime_hl_series_snap-in_socket_customer_process_guidelines/

Thanks,
Alex

3

Hi,

In fact we are working with molded module of HL8548-G and we are looking for the type of glue/resin used for overmolding compound .
For the metal sputtering we suppose it’s aluminium but are also looking for confirmation.

Thanks in advance

4

We ve got info from Sierra FAE : it’s resin provided by KYOCERA with specifications next to FR4

br,