I’m following the 5: Routing Constraints and Recommendations section of the AirPrime WP76xx Technical Specification for the project I’m currently working on.
My PCB stackup is as follows:
MID1: Ground Plane only
The WP76xx module will be placed on the TOP layer.
I would appreciate some help with the following tip:
Tip: Avoid routing any signals under the module on the application board.
I have been looking at the MangOH green reference design and I see this TIP complete ignored. You can see routing everywhere under the module. Also in my opinion routing under the module seems to be unavoidable. Also I don’t see why you can’t have traces under the module on other layers, like MID2 and BOT, given that there is a ground plane before.
Does the phrase “under the module” means the layer (TOP or BOT) where the module is placed? If that is the case, the TIP makes a lot more sense.
Your help will be greatly appreciated.