Documentation Errors & Omissions

#1

Ooh - a new seciton to the forum:

Well, herre are some previously noted documentation errors & omissions

A&D Return code -22, ADL_AD_RET_ERROR, undocumented
wavecom.com/modules/movie/sc … .php?t=705

ADL_AT_PORT_TYPE not documented; adl_atCmdCreate incorrectly documented
wavecom.com/modules/movie/sc … .php?t=560

Hardware Timer Access - Undocumented
wavecom.com/modules/movie/sc … .php?t=541

Endian-ness Undocumented
wavecom.com/modules/movie/sc … .php?t=519

#2

Seems it’s still not (properly) documented: https://forum.sierrawireless.com/t/adl-ad-ret-error-from-adl-adsubscribe/4999/3

#3

Hi
For the A&D Return code -22, ADL_AD_RET_ERROR, undocumented issue a documentation tracker has been created.

Regards
Moderator

#4

Great!

:smiley:

Where can we follow these “documentation tracker” items?

#5

Hi Awneil

The tracker regarding the same has been fixed and the documentation will be updated from the next OASIS release i.e. 2.36.

Regards
Moderator

#6

:smiley:

When is that due to be released?

#7

Hi,
I am building an as detailled as possible SL808 module in order to verify the thermal behaviour. I will have to run a thermal simulation in an automotive environement.
I miss information about the module PCB itself. Here are my needs:

  • How many layers?
  • What is the copper thickness for each?
  • What is the copper coverage percentage for each?
  • How many vias passing completely through this PCB?
  • What are the internal and external diameter of vias?
    Those information are mandatory to be able to calculate the thermal conductivity in plane and through the PCB.
    Thank you!
#8

same post again : [url]https://forum.sierrawireless.com/t/sl808-pcb-data/7218/1]